Digital signal integrity-modeling and simulation with by Brian Young

By Brian Young

Supplies engineers the idea and functional equipment had to version and simulate high-speed connections and are expecting real-world functionality with interconnects and applications. includes in-depth experiences of a bunch of themes, together with crosstalk, generalized termination schemes and differential signaling. DLC: sign processing--Digital techniques--Computer simulation.

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Springer Science+Business Media New York 2015 H. Kam, F. 1007/978-1-4939-2128-7_3 47 48 3 Micro-relay Technologies Relays A. C. B. D. CMOS Fig. 1 Process integration considerations for micro-relay technology: A. Structural material with low residual stress, strain gradient, and electrical resistivity. B. Formation of nanoscale actuation gap. C. Reliable contact material. D. Integration with CMOS electronics As will be discussed to in Chap. 4, contacting materials with low surface adhesion, high melting point, and reasonably low resistivity are needed to achieve high relay contact endurance with sufficiently low (~10 kΩ) metal-to-metal contact resistance.

Substituting Eqs. 44) into the boundary conditions Eq. e. Eqs. 51) are simply the beam equation and boundary conditions for the unstressed beam, they are automatically satisfied. To solve for the first-order correction z1(x), we first substitute the beam deflection for the unstressed beam z0(x) given by Eq. 28) into Eq. 48) and get   d 2 z1 ðxÞ 1 1 0 2 1 0 3 1 1 4 4 1 ÀMA À MA x À RA x þ qhx À x1 i À qhx À x2 i ¼ EI dx2 EI 2 6 24 24 ð2:53Þ 30 2 Design and Modeling of Micro-relay Integrating both sides of Eq.

Actuators A. Phys. 97–98, 337–346 (2002) 6. C. G. Budynas, Roark’s Formulas for Stress and Strain, vol. 6 (McGraw-Hill, New York, NY, 2002) 7. J. Jeon, V. Pott, H. Kam, R. Nathanael, E. J. King Liu, Perfectly complementary relay design for digital logic applications. IEEE Elect. Dev. Lett. 31, 371–373 (2010) 8. R. Holm, E. Holm, Electric Contacts; Theory and Application, 4th edn. (Springer, Berlin, 1967) 9. V. Sharvin, Sharvin Resistance Formula. Sov. Phys. JETP. 21, pp. 655 (1965) 10. B. B. Allen, Electron transport through a circular constriction.

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